Manufacturing capabilities

Numbers below are our regular production range. If your design is outside it, send the data anyway and our engineers will check it.

Item	Capability
Layers	1 layer (single-sided), 2 layers (double-sided); 4 layers on request
Materials	FR-4, High-Tg FR-4, Halogen-free FR-4, BT resin (white), CEM, Aluminum (metal core)
Board thickness	Standard 0.4 – 1.8 mm · Special 0.1 – 0.39 mm
Smallest board size	3 × 3 mm
Copper thickness	Standard 17 / 35 µm · Special 8, 12, 70, 105 µm · Unbalanced copper (e.g. ½ oz / 1 oz, ½ oz / 2 oz, 1 oz / 2 oz)
Line width / space (outer)	Standard 125 µm · Special 75 µm
Drill size	0.2 – 6.5 mm (mechanical) · smallest via 0.15 mm
Drill position tolerance	±20 µm
SMD pitch	0.12 mm
Impedance control	±10 % (±5 % on request)
Surface finish	ENIG, electrolytic hard gold, soft gold, OSP, lead-free HASL, immersion tin, carbon ink, peelable mask
Gold thickness	ENIG 0.03 – 0.05 µm · Hard (electrolytic) gold 0.03 – 1.5 µm · Soft gold 0.3 – 1.3 µm
Profile	Routing, V-cut, press punching
Testing	Electrical test (BBT), AOI, final visual inspection

Ready for a quote?

Send your Gerber files and quantity. Our engineers check the data and reply with a price.